Register now to gain insights into the requirements of international suppliers and clients and enhance the ability to expand in the international market through effective communication.

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CHINAPLAS 2025 Dissemination Seminar

 

Dear Sir/Madam,

 

Federation of Hong Kong Industries has successfully obtained funding from the Trade and Industrial Organisation Support Fund of the Trade and Industry Department to launch the 18-month project “To promote the comprehensive technical competency of Hong Kong precision mould and plastic component manufacturing industry through technical demonstrations in global market”. The recent project successfully established the "Hong Kong Pavilion" at “CHINAPLAS 2025" in Shenzhen, showcasing automatic plastic injection moulding line, precision mould and plastic components. This initiative promoted the technological advancement of Hong Kong’s mould  and plastic component manufacturers, highlighting their comprehensive technical competency on the international stage.


The seminar will be held to share the exhibition outcomes, provide the overview of the “Hong Kong Pavilion”, and invite industry participants to share their achievements, market insights, and business opportunities. Through this exchange, attendees will gain a better understanding of the requirements of international suppliers and customers, thereby enhancing the capability of Hong Kong’s mould and plastic industries to expand into the global market.

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7 July 2025

14:00 - 15:00

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Room 126, 1/F, HKPC Building, 78 Tat Chee Avenue, Kowloon

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Cantonese

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Individuals in the mould and plastic component manufacturing industry

More Info & Enrol

 Inquiry:

Mr MA|+852 2788 6105|martinma@hkpc.org

Mr CHAN|+852 2788 5518|hcchan@hkpc.org

Disclaimer:​​

Any opinions, findings, conclusions or recommendations expressed in this material/event (or by members of the project team) do not reflect the views of the Government of the Hong Kong Special Administrative Region or the Vetting Committee of the Trade and Industrial Organisation Support Fund.

Please be advised that the views and opinions expressed in the panels by the speakers are not those of HKPC, and accordingly, HKPC takes no responsibility for the accuracy or completeness of the contents provided and shared by the speakers, and expressly disclaims any liability whatsoever for any claim, loss or damage howsoever arising from the use of or in reliance upon the whole or any part of the contents thereof.​​

The speakers’ speech or opinions regarding the future development, tend and conditions of the economy, industry and market may involve the forward-looking views, predictions and statements which are subject to the influence of certain risks, unexpected or uncertainties factors and assumptions. You shall pay caution and assess the risks thereof.​

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